Directorate-General for Communications Networks, Content and Technology and European Commission 3 June 2026, Proposal for a REGULATION OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL on a framework of measures for strengthening the Union’s semiconductor ecosystem, repealing Regulation (EU) 2023/1781 (Chips Act 2.0)

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This proposal for a Regulation of the European Parliament and of the Council (Chips Act 2.0), based on Articles 173(3) and 114 TFEU, repeals Regulation (EU) 2023/1781 and establishes a reinforced framework to strengthen the Union's semiconductor ecosystem by addressing overdependence on third countries for semiconductor design and manufacturing and insufficient crisis preparedness. The Regulation is structured around three pillars: Pillar I (Chips for Europe Initiative 2.0) supports large-scale research, innovation, and industrial deployment capacities including design platforms, pilot lines, quantum chips, competence centres, photonic integrated circuits, a Chips Fund, and grand challenges; Pillar II establishes a framework for recognising European semiconductor technology initiatives and strategic projects, streamlining permit-granting procedures, introducing a European Semiconductor Region of Excellence label, and integrating security-of-supply criteria into public procurement for critical infrastructures. Pillar III enhances monitoring and crisis-response mechanisms, including a Business-to-Business Semiconductor Supply Chain Platform, strategic mapping, early-warning indicators, and emergency measures—such as mandatory priority-rated orders and common purchasing—activatable by Council implementing act upon Commission proposal in the event of a declared semiconductor crisis.AI